Location: Patiala

Thapar Institute of Engineering & Technology (TIET), Patiala, Punjab, invites applications from highly qualified, dynamic, and research-oriented candidates for the position of Assistant Professor (Regular/Contractual) in the Department of Mathematics. The institute seeks individuals with outstanding academic credentials, strong research potential, and expertise in Mathematics, Computing, Statistics, Computer Science, Operating Research, or other related disciplines. Candidates with a proven commitment to teaching excellence, interdisciplinary research, innovation, and academic leadership are encouraged to apply. Interested and eligible candidates may submit their applications online through the official recruitment portal.

Thapar Institute of Engineering & Technology (TIET), Patiala, Punjab, invites applications from eligible candidates for Assistant Professor positions on a Regular and Contractual basis in the Department of Electrical and Instrumentation Engineering. Candidates with relevant qualifications in Electrical and Instrumentation Engineering, along with expertise in emerging areas of the discipline, are encouraged to apply. Interested candidates should submit their applications online through the official faculty recruitment portal.

Swami Vivekanand Institute of Engineering & Technology (SVIET), Banur, Rajpura, Punjab, has invited applications from eligible and prospective candidates for Head of Department, Professor, Associate Professor, Assistant Professor, Trainer, and Analyst positions across multiple departments, including Engineering, Allied Health Sciences, Pharmacy, Journalism & Mass Communication, and Management disciplines. Interested candidates should send their applications through email to the Human Resource Department within 7 days from the publication of the advertisement.

Swami Vivekanand Institute of Engineering & Technology (SVIET), Rajpura invites applications for Assistant Professor, Associate Professor, Professor, and HOD positions in the CSE department. Apply via email.